Ortiz & Lopez, PLLC ("O&L") has successfully prosecuted a series of semiconductor patents to issuance for Kambix Innovations, LLC, a company dedicated to pioneering advancements in thermal management for three-dimensional (3D) integrated circuit (IC) chips. Kambix’s innovations address a critical challenge in the semiconductor industry: managing heat dissipation in densely packed microelectronic components.
As semiconductor devices evolve, the demand for more compact, efficient, and powerful chips continues to grow. One area where this trend is particularly significant is 3D IC chips, which stack multiple layers of silicon wafers or dies to achieve performance enhancements with lower power consumption and a smaller footprint compared to traditional two-dimensional (2D) chip designs. The vertical stacking of these chips, interconnected through techniques like through-silicon vias (TSVs) or Cu-Cu connections, allows for increased functionality in the z-direction. However, the compact design presents new thermal management challenges that directly impact the reliability and longevity of the system.
O&L’s experience in prosecuting semiconductor patents is exemplified by its work with Kambix. The firm has filed numerous patent applications on behalf of Kambix, focusing on innovative solutions for addressing the thermal issues inherent in 3D IC technology. One such innovation is covered by U.S. Patent No. 11,942,453, entitled “Thermal Management of Three-Dimensional Integrated Circuits,” which issued on March 26, 2024. This patent discloses a unique thermal management solution involving a 3D IC device with an advanced heat spreader and heat sink configuration designed to maximize heat dissipation efficiency. The patented invention includes a ring-shaped array of inserts arranged around an electronic device, with the inserts exhibiting geometries optimized for cooling performance. This solution addresses a critical problem in 3D IC technology and was recently licensed to a leading semiconductor company, highlighting the value of O&L’s work.
O&L’s deep understanding of the technical and legal challenges in semiconductor patent prosecution makes it well-equipped to assist other companies in protecting their innovations. With a track record of successfully securing patents in cutting-edge areas like 3D IC thermal management, O&L is poised to help clients navigate the complexities of semiconductor technology patents.
If your company is developing semiconductor technologies, Ortiz & Lopez, PLLC can provide the expertise needed to secure strong patent protection and help your innovations succeed in the marketplace.